3D992 Category 3D
“Software” for the “development” or “production” of commodities specified in 3B001.a.4, c, d, f.1, f.5, f.6, k to n, p.2, p.4, r, or 3B002.c and “software” as follows (see List of Items Controlled).
Category 3: Electronics
Reasons for control
- NS: National security
- RS: Regional stability
- AT: Anti-terrorism
Country chart
| Control | Column |
|---|---|
| AT applies to entire entry | AT 1 |
| NS applies to the entire entry | None |
| NS applies to “software” for equipment controlled by 3B001.c.1.a or c.1.c | None |
| RS applies to the entire entry | None |
| RS applies to “software” for equipment controlled by 3B001.c.1.a or c.1.c | None |
List-based license exceptions
| Exception | As stated in the entry |
|---|---|
| TSR | N/A IEC: Yes, for “software” for equipment controlled by 3B001.c.1.a and 3B001.c.1.c, see § 740.2(a)(22) and § 740.24 of the EAR. |
Items
- a. “Software” “specially designed” for the “development” or “production,” of commodities specified in 3B001.a.4, c, d, f.1, f.5, f.6, k to n, p.2, p.4, r, or 3B002.c.
- b. 'Electronic Computer-Aided Design' ('ECAD') “software” designed for the integration of multiple dies into a 'multi-chip' integrated circuit, and having all of the following:
- b.1. Floor planning; and
- b.2. Co-design or co-simulation of die and package.
- c. “Software” not specified by 3D992.a designed or modified to perform all of the following in or with deep-ultraviolet immersion photolithography equipment:
- c.1. Decrease the minimum resolvable feature specified by 3B001.f.1.b; and
- c.2. Decrease the maximum 'dedicated chuck overlay' of deep-ultraviolet immersion lithography equipment below or equal to 1.5 nm.
Related controls
For additional controls that apply to this ECCN, see also § 744.11(a)(2)(v) and (a)(3) and § 744.23(a)(4)(iii) of the EAR.
Notes
Technical Note: For the purposes of 3D992.b, 'multi-chip' includes multi-die and multi-chiplet.
Source: eCFR, version
2026-08-01, retrieved
2026-08-20T04:04:59+00:00.