3E004 Category 3E
“Technology” “required” for the slicing, grinding and polishing of 300 mm diameter silicon wafers to achieve a 'Site Front least sQuares Range' ('SFQR') less than or equal to 20 nm at any site of 26 mm x 8 mm on the front surface of the wafer and an edge exclusion less than or equal to 2 mm.
Category 3: Electronics
Reasons for control
- NS: National security
- AT: Anti-terrorism
Country chart
List-based license exceptions
| Exception | As stated in the entry |
|---|---|
| TSR | Yes |
Items
- The list of items controlled is contained in the ECCN heading.
Related controls
N/A
Source: eCFR, version
2026-08-01, retrieved
2026-08-20T04:04:59+00:00.