3B903 Category 3B
Scanning Electron Microscope (SEM) equipment designed for imaging semiconductor devices or integrated circuits, having all of the following (See List of Items Controlled).
Category 3: Electronics
Reasons for control
- NS: National security
- RS: Regional stability
- AT: Anti-terrorism
Country chart
| Control | Column |
|---|---|
| AT applies to entire entry | AT 1 |
| NS applies to entire entry | None |
| RS applies to the entire entry | None |
List-based license exceptions
| Exception | As stated in the entry |
|---|---|
| GBS | N/A IEC: Yes, see § 740.2(a)(22) and § 740.24 of the EAR. |
| LVS | N/A |
Items
- Related Definition: N/A
- a. Stage placement accuracy less (better) than 30 nm;
- b. Stage positioning measurement performed using laser interferometry;
- c. Position calibration within a field-of-view (FOV) based on laser interferometer length-scale measurement;
- d. Collection and storage of images having more than 2 x 10 8 pixels;
- e. FOV overlap of less than 5 percent in vertical and horizontal directions;
- f. Stitching overlap of FOV less than 50 nm; and
- g. Accelerating voltage more than 21 kV.
Related controls
See ECCNs 3D901 for related “development” or “production” “software”, ECCN 3E901 for related “development” and “production” “technology”.
Notes
Note 1: 3B903 includes SEM equipment designed for chip design recovery.
Note 2: 3B903 does not apply to SEM equipment designed to accept a Semiconductor Equipment and Materials International (SEMI) standard wafer carrier, such as a 200 mm or larger Front Opening Unified Pod (FOUP).
Source: eCFR, version
2026-08-01, retrieved
2026-08-20T04:04:59+00:00.